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1. general description the TFF1015HN/n1 is an integrated downconverter for use in low noise block (lnb) convertors in a 10.7 ghz to 12.75 ghz k u band satellite receiver system. 2. features and benefits ? low current consumption integrated pre-amplifier, mixer, buffer amplifier and pll synthesizer ? flat gain over frequency ? single 5 v supply pin ? low cost 25 mhz crystal ? crystal controlled lo frequency generation ? switched lo frequency (9.75 ghz and 10.6 ghz) ? low phase noise ? low spurious ? low external component count ? alignment-free concept ? esd protection on all pins 3. applications ? k u band lnb converters for digital satellite reception (dvb-s / dvb-s2) 4. quick reference data TFF1015HN/n1 integrated mixer oscilla tor pll for satellite lnb rev. 1 ? 12 september 2011 product data sheet table 1. quick reference data v cc = 5 v; t amb = 25 ? c; f lo = 9.75 ghz or 10.6 ghz; f xtal = 25 mhz; z 0 = 50 ? unless otherwise specified. symbol parameter conditions min typ max unit v cc supply voltage 4.5 5 5.5 v i cc supply current rf input and if output ac coupled - 52 - ma nf ssb single sideband noise figure measured at low band f if = 1450 mhz and high band f if =1625mhz -7- db f i(rf) rf input frequency low band 10.7 - 11.7 ghz high band 11.7 - 12.75 ghz g conv conversion gain measured at low band f if = 1450 mhz and high band f if =1625mhz -39- db
TFF1015HN_n1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 12 september 2011 2 of 12 nxp semiconductors TFF1015HN/n1 integrated mixer oscillato r pll for satellite lnb 5. ordering information 6. block diagram s 11 input reflection coefficient f rf = 10.7 ghz to 12.7 ghz - ? 10 - db s 22 output reflection coefficient f if_out = 950 mhz to 2150 mhz; z 0 =75 ? - ? 10 - db ip3 o output third-order intercept point carrier power is ? 10 dbm (measured at output) - 15 - dbm table 1. quick reference data ?continued v cc = 5 v; t amb = 25 ? c; f lo = 9.75 ghz or 10.6 ghz; f xtal = 25 mhz; z 0 = 50 ? unless otherwise specified. symbol parameter conditions min typ max unit table 2. ordering information type number package name description version TFF1015HN/n1 dhvqfn16 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 ? 3.5 ? 0.85 mm sot763-1 fig 1. TFF1015HN/n1 block diagram aaa-000007 if 14 3 2 4 5 1 16 6 7 9 8 12 10 hb 11 15 13 if_gnd rf_gnd1 n.c. rf rf_gnd2 rf_gnd3 v cc gnd1 n.c. vreg lf xo1 xo2 gnd2 divider pfd charge pump on-chip regulator internal supplies and bias
TFF1015HN_n1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 12 september 2011 3 of 12 nxp semiconductors TFF1015HN/n1 integrated mixer oscillato r pll for satellite lnb 7. functional diagram 8. pinning information 8.1 pinning 8.2 pin description fig 2. functional diagram pll hb xo2 xo1 rf v cc i 9.75 ghz/10.6 ghz aaa-00000 fig 3. pin configuration aaa-000009 n.c. hb gnd1 xo2 rf_gnd2 xo1 rf gnd2 n.c. if rf_gnd1 if_gnd lf vreg rf_gnd3 v cc transparent top view 7 10 6 11 5 12 4 13 3 14 2 15 8 9 1 16 terminal 1 index area table 3. pin description symbol pin description gnd 0 ground (exposed die pad) rf_gnd3 1 rf ground. connect this pin to the exposed die pad landing. rf_gnd1 2 rf ground. connect this pin to the ex posed die pad landing and the rf input cpw line. n.c. 3 not connected. connect to rf on pcb. [1] rf 4 rf input. rf_gnd2 5 rf ground. connect this pin to the ex posed die pad landing and the rf input cpw line.
TFF1015HN_n1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 12 september 2011 4 of 12 nxp semiconductors TFF1015HN/n1 integrated mixer oscillato r pll for satellite lnb [1] the distance between the outer edges of pin 2 and pin 3 is 740 ? m. this gives an optimum transition from a 1.1 mm wide, z 0 = 50 ? line on ro4223 printed-circuit board (pcb) material of 0.5 mm height to the TFF1015HN/n1. 9. limiting values 10. recommended operating conditions [1] for a 10.75 ghz lo frequency, select high band and use a crystal with frequency 10.75 ghz / 424 = 25.353774 mhz. gnd1 6 ground. connect this pin to the exposed die pad landing and the rf input cpw line. n.c. 7 not connected. use this pin to route the groun d layer on top of the pcb to the exposed die pad. lf 8 loop filter pll. connect loop filter between this pin and vreg (pin 9). vreg 9 regulated output voltage for pll loop filter. connect loop filter to this pin. decouple against die pad via pin 7. hb 10 high band / low band selection. connect this pi n to the tone detector or to a logic signal. xo2 11 crystal connection 2. connect cryst al between this pin and xo1 (pin 12). xo1 12 crystal connection 1. connect cryst al between this pin and xo2 (pin 11). gnd2 13 ground. connect this pin to the exposed die pad landing. if 14 if output if_gnd 15 if output ground. connect this pin to the expo sed die pad landing and the output transmission line ground. v cc 16 supply voltage table 3. pin description ?continued symbol pin description table 4. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +6 v v i(hb) input voltage on pin hb ? 0.5 +6 v t stg storage temperature ? 40 +125 ?c table 5. operating conditions symbol parameter conditions min typ max unit v cc supply voltage 4.5 5 5.5 v v i(hb) input voltage on pin hb 0 - 5.5 v t amb ambient temperature ? 40 +25 +85 ?c z 0 characteristic impedance - 50 - ? f i(rf) rf input frequency low band 10.7 - 11.7 ghz high band 11.7 - 12.75 ghz f lo lo frequency low band - 9.75 - ghz high band [1] -10.6- ghz f o(if) if output frequency low band 0.95 - 1.95 ghz high band 1.1 - 2.15 ghz c l(xtal) crystal load capacitance - 10 - pf esr equivalent series resistance - - 40 ? f xtal crystal frequency - 25 - mhz
TFF1015HN_n1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 12 september 2011 5 of 12 nxp semiconductors TFF1015HN/n1 integrated mixer oscillato r pll for satellite lnb 11. thermal characteristics 12. characteristics table 6. thermal characteristics symbol parameter conditions typ unit r th(j-c) thermal resistance from junction to case 35 k/w table 7. characteristics v cc = 5 v; t amb = 25 ? c; f lo = 9.75 ghz or 10.6 ghz; f xtal = 25 mhz; z 0 = 50 ? unless otherwise specified. symbol parameter conditions min typ max unit i cc supply current rf input and if output ac coupled - 52 - ma ? n ? (itg) integrated phase noise density integration offset frequency = 10khzto13mhz; loop bandwidth = crossover bandwidth -1.5- ? rms nf ssb single sideband noise figure measured at low band f if = 1450 mhz and high band f if = 1625 mhz -7- db g conv conversion gain measured at low band f if = 1450 mhz and high band f if = 1625 mhz -39- db ? g conv conversion gain variation over whole if band - 2.0 - db in every 36 mhz band - 0.5 - db s 11 input reflection coefficient f rf = 10.7 ghz to 12.7 ghz - ? 10 - db s 22 output reflection coefficient f if_out = 950 mhz to 2150 mhz; z 0 =75 ? - ? 10 - db ip3 o output third-order intercept point carrier power is ? 10 dbm (measured at the output) -15- dbm p l(1db) output power at 1 db gain compression -6- dbm v il(hb) low level input voltage on pin hb - - 0.8 v v ih(hb) high level input voltage on pin hb 2.0 - - v r pd(hb) pull down resistance on pin hb 80 110 140 k ?
TFF1015HN_n1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 12 september 2011 6 of 12 nxp semiconductors TFF1015HN/n1 integrated mixer oscillato r pll for satellite lnb 13. application information fig 4. application diagram of TFF1015HN/n1 5 v linear regulator 9 v ~ 21 v 5 v phemt bias v/t detector lb hb d2 g2 dv gv rf_gnd1 if_gnd if gnd2 xo1 25 mhz crystal if xo2 hb rf_gnd3 lf vreg v cc n.c. 2 116 89 3 4 5 6 7 15 14 13 12 11 10 dh gh aaa-000010 gh h v dh gv dv g2 d2 rf rf_gnd2 gnd1 n.c. 1 f 1 f 100 nf 100 pf 220 pf 330 table 8. list of netnames see figure 4 . netname description gh gate voltage of 1st stage lna. horizontal polarization dh drain voltage of 1st stage lna. horizontal polarization gv gate voltage of 1st stage lna. vertical polarization dv drain voltage of 1st stage lna. vertical polarization g2 gate voltage of 2nd stage lna d2 drain voltage of 2nd stage lna hb high band oscillator supply control lb low band oscillator supply control
TFF1015HN_n1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 12 september 2011 7 of 12 nxp semiconductors TFF1015HN/n1 integrated mixer oscillato r pll for satellite lnb fig 5. lnb system block diagram with TFF1015HN/n1 supply and band/polarization switching 5 v regulator v cc hb rf gain image reject filter horizontal polarization vertical polarization mixer lf gain pll 9.75 ghz/10.6 ghz 1st stage lna 1st stage lna 2nd stage lna aaa-000011
TFF1015HN_n1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 12 september 2011 8 of 12 nxp semiconductors TFF1015HN/n1 integrated mixer oscillato r pll for satellite lnb 14. package outline fig 6. package outline sot763-1 terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 3.6 3.4 d h 2.15 1.85 y 1 2.6 2.4 1.15 0.85 e 1 2.5 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot763-1 mo-241 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot763-1 dhvqfn16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 27 15 10 9 8 1 16 x d e c b a terminal 1 index area ac c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1) 02-10-17 03-01-27
TFF1015HN_n1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 12 september 2011 9 of 12 nxp semiconductors TFF1015HN/n1 integrated mixer oscillato r pll for satellite lnb 15. abbreviations 16. revision history table 9. abbreviations acronym description cpw coplanar waveguide dvb-s digital video broadcasting by satellite dvb-s2 digital video broadcasting - satellite - second generation esd electrostatic discharge if intermediate frequency k u band k-under band lo local oscillator pfd phase frequency detector phemt pseudomorphic high elec tron mobility transistor pll phase-locked loop rf radio frequency vco voltage-controlled oscillator v/t voltage / tone table 10. revision history document id release date data sheet status change notice supersedes TFF1015HN_n1 v.1 20110912 product data sheet - -
TFF1015HN_n1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 12 september 2011 10 of 12 nxp semiconductors TFF1015HN/n1 integrated mixer oscillato r pll for satellite lnb 17. legal information 17.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 17.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 17.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
TFF1015HN_n1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 12 september 2011 11 of 12 nxp semiconductors TFF1015HN/n1 integrated mixer oscillato r pll for satellite lnb non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully in demnifies nxp semi conductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. 17.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 18. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors TFF1015HN/n1 integrated mixer oscillato r pll for satellite lnb ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 12 september 2011 document identifier: TFF1015HN_n1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 19. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 1 5 ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 8 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 8.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 10 recommended operating conditions. . . . . . . . 4 11 thermal characteristics . . . . . . . . . . . . . . . . . . 5 12 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 13 application information. . . . . . . . . . . . . . . . . . . 6 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 15 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 16 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 17 legal information. . . . . . . . . . . . . . . . . . . . . . . 10 17.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 17.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 17.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 17.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 18 contact information. . . . . . . . . . . . . . . . . . . . . 11 19 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

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